Invention Grant
- Patent Title: Die for molding honeycomb structure and manufacturing method thereof
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Application No.: US10481751Application Date: 2002-11-05
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Publication No.: US07670644B2Publication Date: 2010-03-02
- Inventor: Susumu Matsuoka , Seiichi Inoue , Haremi Ito , Keiji Matsumoto
- Applicant: Susumu Matsuoka , Seiichi Inoue , Haremi Ito , Keiji Matsumoto
- Applicant Address: JP Nagoya
- Assignee: NGK Insulators, Ltd.
- Current Assignee: NGK Insulators, Ltd.
- Current Assignee Address: JP Nagoya
- Agency: Oliff & Berridge, PLC
- Priority: JP2001-338839 20011105
- International Application: PCT/JP02/11489 WO 20021105
- International Announcement: WO03/039828 WO 20030515
- Main IPC: C23C16/00
- IPC: C23C16/00

Abstract:
A die for extrusion-forming a honeycomb structure which includes: a die base provided with ceramic puddle introducing holes and slits in communication with the ceramic puddle introducing holes; and a substrate layer, which roughly defines the final width of the slits, and a surface layer, which precisely defines the final width of the slits, formed on the die base in this order so that the final width of the slits becomes 15 to 200 μm, wherein the surface layer is made up of tungsten carbide particles which are 5 μm or less in average particle diameter and contain W3C as a main ingredient. According to this invention, there is provided a die for extrusion-forming a honeycomb structure which can restrain fluctuation in extrusion-forming speed among its parts and resistance to pushing force, both caused at the time of extrusion-forming, to be very small and is superior in productivity and durability.
Public/Granted literature
- US20050031727A1 Honeycomb structural body forming ferrule and method of manufacturing the ferrule Public/Granted day:2005-02-10
Information query
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