Invention Grant
- Patent Title: Honeycomb structure body
- Patent Title (中): 蜂窝结构体
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Application No.: US12239260Application Date: 2008-09-26
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Publication No.: US07670664B2Publication Date: 2010-03-02
- Inventor: Atsushi Watanabe , Naoshi Masukawa , Shuichi Ichikawa
- Applicant: Atsushi Watanabe , Naoshi Masukawa , Shuichi Ichikawa
- Applicant Address: JP Nagoya
- Assignee: NGK Insulators, Ltd.
- Current Assignee: NGK Insulators, Ltd.
- Current Assignee Address: JP Nagoya
- Agency: Oliff & Berridge, PLC
- Priority: JP2006-094267 20060330
- Main IPC: B32B3/12
- IPC: B32B3/12

Abstract:
In a honeycomb structure 1 which is made of a ceramic and in which a plurality of honeycomb segments 12 having cell structures 5 and porous outer walls 7 on outer peripheries of the cell structures 5 are integrated by bonding these outer walls 7 to one another with a bonding material 8, each of the cell structures being provided with a plurality of cells 3 constituting fluid channels divided by porous partition walls 2, a base material constituting the honeycomb structure 1 has a thermal conductivity of 0.1 to 20 W/mK. Moreover, an outer periphery coating material constituting the outer peripheral wall of the honeycomb structure 1 has a porosity of 10 to 60%. Furthermore, the outer periphery coating material constituting the outer peripheral wall of the honeycomb structure 1 has a thermal conductivity of 0.01 to 0.5 W/mK.
Public/Granted literature
- US20090022944A1 HONEYCOMB STRUCTURE BODY Public/Granted day:2009-01-22
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