Invention Grant
- Patent Title: Multilayer ceramic substrate and method for producing same
- Patent Title (中): 多层陶瓷基板及其制造方法
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Application No.: US12265984Application Date: 2008-11-06
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Publication No.: US07670672B2Publication Date: 2010-03-02
- Inventor: Yuichi Iida
- Applicant: Yuichi Iida
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2007-103439 20070411
- Main IPC: H05K3/46
- IPC: H05K3/46

Abstract:
In a multilayer ceramic substrate having a cavity, base-material layers are arranged on a base side with respect to an interface between the base and a wall defining a cavity, and a constraining interlayer is arranged on the wall side. A conductive film is arranged between the base-material layers and the constraining interlayer, the base-material layers and the constraining interlayer sandwiching the interface. The effect of the first conductive film results in an increase in the adhesion of the constraining interlayer to the substrate layers, thus enhancing a shrinkage-inhibiting effect of the constraining interlayer.
Public/Granted literature
- US20090053532A1 MULTILAYER CERAMIC SUBSTRATE AND METHOD FOR PRODUCING SAME Public/Granted day:2009-02-26
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