Invention Grant
US07670675B2 High-temperature layered system for dissipating heat and method for producing said system
有权
用于散热的高温分层系统和用于生产所述系统的方法
- Patent Title: High-temperature layered system for dissipating heat and method for producing said system
- Patent Title (中): 用于散热的高温分层系统和用于生产所述系统的方法
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Application No.: US10578425Application Date: 2004-10-12
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Publication No.: US07670675B2Publication Date: 2010-03-02
- Inventor: Andreas Heselhaus
- Applicant: Andreas Heselhaus
- Applicant Address: DE Munich
- Assignee: Siemens Aktiengesellschaft
- Current Assignee: Siemens Aktiengesellschaft
- Current Assignee Address: DE Munich
- Priority: EP03026281 20031114
- International Application: PCT/EP2004/011429 WO 20041012
- International Announcement: WO2005/049312 WO 20050602
- Main IPC: B32B5/14
- IPC: B32B5/14 ; B32B15/00 ; F01D5/14 ; F23R3/00 ; F01D5/28 ; B32B18/00
Abstract:
Layered systems in prior art are inefficient at cooling an external hot gas. The inventive layered system comprises an external porous layer, in which the pore walls of the pores have differing thicknesses. This improves the cooling action by preventing too much heat from entering the layered system.
Public/Granted literature
- US20070275210A1 High-Temperature Layered System for Dissipating Heat and Method for Producing Said System Public/Granted day:2007-11-29
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