Invention Grant
- Patent Title: Positive photosensitive composition and method of forming resist pattern
-
Application No.: US10895824Application Date: 2004-07-22
-
Publication No.: US07670746B2Publication Date: 2010-03-02
- Inventor: Kunihiko Kodama
- Applicant: Kunihiko Kodama
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JPP2003-278995 20030724
- Main IPC: G03F7/004
- IPC: G03F7/004 ; G03F7/30
Abstract:
A positive photosensitive composition comprises: (A) 5 to 20 parts by weight of the total amount of at least one compound that generates an acid upon irradiation with an actinic ray; and (B) 100 parts by weight of the total amount of at least one fluorine atom-containing resin having a group that increases a solubility of the resin in an alkaline developer by the action of an acid.
Public/Granted literature
- US07867697B2 Positive photosensitive composition and method of forming resist pattern Public/Granted day:2011-01-11
Information query
IPC分类:
