A pattern transfer method includes first through third steps. In the first step, a desired pattern is transferred onto a resin layer formed on a substrate, a release layer being disposed between the substrate and the resin layer. In the second step, which is executed after the first step, the pattern having been transferred onto the resin layer is transferred to the substrate and the release layer is partially exposed. In the third step, which is executed after the second step, the release layer present between the substrate and the resin layer is dissolved and is thus removed from the substrate.