Invention Grant
- Patent Title: Exposure apparatus having a processing chamber, a vacuum chamber and first and second load lock chambers
- Patent Title (中): 具有处理室,真空室和第一和第二负载锁定室的曝光装置
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Application No.: US11001116Application Date: 2004-12-02
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Publication No.: US07670754B2Publication Date: 2010-03-02
- Inventor: Ryo Edo , Masami Yonekawa , Shinichi Hara
- Applicant: Ryo Edo , Masami Yonekawa , Shinichi Hara
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Fitzpatrick, Cella, Harper & Scinto
- Priority: JP2003-404023 20031203
- Main IPC: H01L21/00
- IPC: H01L21/00 ; G03F7/00 ; G03B27/42

Abstract:
An exposure apparatus for executing an exposure of a substrate to light via a mask. The apparatus includes a booth which stores the mask in an atmospheric pressure, a processing chamber in which the exposure is executed in a first vacuum pressure, a vacuum chamber, arranged between the booth and the processing chamber, stores the mask at a second vacuum pressure that is higher than the first vacuum pressure and is between 0.1 Pa and 100 Pa, a first load lock chamber, arranged between the booth and the vacuum chamber, through which the mask is transferred, in which the atmospheric pressure and the second vacuum pressure are replaceable, and a second load lock chamber arranged between the vacuum chamber and the processing chamber, through which the mask is transferred, in which the second vacuum pressure and the first vacuum pressure are replaceable.
Public/Granted literature
- US20050121144A1 Processing system and exposure apparatus using the same Public/Granted day:2005-06-09
Information query
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