Invention Grant
US07670755B2 Photomask correcting method and manufacturing method of semiconductor device
失效
半导体器件的光掩模校正方法及其制造方法
- Patent Title: Photomask correcting method and manufacturing method of semiconductor device
- Patent Title (中): 半导体器件的光掩模校正方法及其制造方法
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Application No.: US12216051Application Date: 2008-06-27
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Publication No.: US07670755B2Publication Date: 2010-03-02
- Inventor: Hideki Kanai
- Applicant: Hideki Kanai
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- Priority: JP2003-161038 20030605
- Main IPC: G03F7/20
- IPC: G03F7/20

Abstract:
A writing pattern data generating method for, in order to form a first photomask for use in a manufacturing method of a semiconductor device which including forming a first resist pattern on a mask film formed on a first film using the first photomask, forming a first mask pattern by etching the mask film, removing the first resist pattern, forming a second resist film on the mask film, forming a second resist pattern on the mask film, forming a second mask pattern by etching the mask film, removing the second resist pattern, and forming a first film pattern by etching the first film, the generating method comprising correcting a first pattern data in accordance with a difference between the first film pattern and the second mask pattern and a difference between the first resist pattern and the first mask pattern.
Public/Granted literature
- US20080292992A1 Photomask correcting method and manufacturing method of semiconductor device Public/Granted day:2008-11-27
Information query
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