Invention Grant
US07670756B2 Pattern forming method, semiconductor device manufacturing method and exposure mask set 有权
图案形成方法,半导体器件制造方法和曝光掩模组

Pattern forming method, semiconductor device manufacturing method and exposure mask set
Abstract:
First, a first exposure process is performed using dipole illumination with only a grating-pattern forming region as a substantial object to be exposed. Next, a second exposure process is performed with only a standard-pattern forming region as a substantial object to be exposed. A development process is then performed to obtain a resist pattern. A mask for the first exposure process is such that a light blocking pattern is formed on the whole surface of a standard-pattern mask part corresponding to the standard-pattern forming region. A mask for the second exposure is such that a light blocking pattern is formed on the whole surface of a grating-pattern mask part corresponding to the grating-pattern forming region.
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