Invention Grant
- Patent Title: CMOS image sensor and fabricating method thereof
- Patent Title (中): CMOS图像传感器及其制造方法
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Application No.: US11963433Application Date: 2007-12-21
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Publication No.: US07670864B2Publication Date: 2010-03-02
- Inventor: Keun-Hyuk Lim
- Applicant: Keun-Hyuk Lim
- Applicant Address: KR Seoul
- Assignee: Dongbu HiTek Co., Ltd.
- Current Assignee: Dongbu HiTek Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: Sherr & Vaughn, PLLC
- Priority: KR10-2006-0137559 20061229
- Main IPC: H01L51/40
- IPC: H01L51/40

Abstract:
A CMOS image sensor and method of manufacture reduces the problem of electron loss in a floating diffusion area. A method of fabricating a CMOS image sensor includes forming a gate electrode over a first conductive type semiconductor substrate. A second conductive type first diffusion layer is formed within the semiconductor substrate to be aligned with an edge of one side of the gate electrode. A spacer may be attached to both sidewalls of the gate electrode. A first conductive type second diffusion layer may be formed within the first diffusion layer to leave a distance amounting to a width of the spacer in-between. A second conductive type third diffusion layer may be formed within the semiconductor substrate to be aligned with an edge of the other side of the gate electrode. A first conductive type fourth diffusion layer may be formed over the third diffusion layer, and a first conductive type fifth diffusion layer may be formed under the third diffusion layer.
Public/Granted literature
- US20080157147A1 CMOS IMAGE SENSOR AND FABRICATING METHOD THEREOF Public/Granted day:2008-07-03
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