Invention Grant
US07670875B2 Method of manufacturing a single chip semiconductor integrated circuit device including a mask ROM in a short time
失效
在短时间内制造包括掩模ROM的单芯片半导体集成电路器件的方法
- Patent Title: Method of manufacturing a single chip semiconductor integrated circuit device including a mask ROM in a short time
- Patent Title (中): 在短时间内制造包括掩模ROM的单芯片半导体集成电路器件的方法
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Application No.: US11881223Application Date: 2007-07-26
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Publication No.: US07670875B2Publication Date: 2010-03-02
- Inventor: Koji Yano , Tomoki Segawa
- Applicant: Koji Yano , Tomoki Segawa
- Applicant Address: JP Tama-Shi
- Assignee: Mitsumi Electric Co., Ltd.
- Current Assignee: Mitsumi Electric Co., Ltd.
- Current Assignee Address: JP Tama-Shi
- Agency: Frishauf, Holtz, Goodman & Chick, P.C.
- Priority: JP2006-207797 20060731
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L21/48 ; H01L21/50 ; H01L21/338
Abstract:
In a state of a first semiconductor integrated circuit device on which a first semiconductor integrated circuit board including a first mask ROM and a programmable ROM are mounted, an ultimate program determined by using the programmable ROM is stored in a second ROM of a second semiconductor integrated circuit board which is substantially similar in structure to the first semiconductor integrated circuit board, thereby manufacturing a second semiconductor integrated circuit device as an ultimate product.
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