Invention Grant
US07670876B2 Integrated circuit device with embedded passive component by flip-chip connection and method for manufacturing the same
有权
具有嵌入式无源器件的集成电路器件通过倒装芯片连接及其制造方法
- Patent Title: Integrated circuit device with embedded passive component by flip-chip connection and method for manufacturing the same
- Patent Title (中): 具有嵌入式无源器件的集成电路器件通过倒装芯片连接及其制造方法
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Application No.: US12153584Application Date: 2008-05-21
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Publication No.: US07670876B2Publication Date: 2010-03-02
- Inventor: Mon-Chin Tsai
- Applicant: Mon-Chin Tsai
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Agency: Muncy, Geissler, Olds & Lowe, PLLC
- Priority: TW92123944A 20030829
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L21/48
Abstract:
An integrated circuit device with embedded passive component by flip-chip connection is provided which includes a flip chip and a dummy chip. The dummy chip includes at least an embedded passive component, a plurality of redistribution traces and a plurality of flip-chip pads. The flip chip is smaller than the dummy chip and is mounted on a surface of the dummy chip with the flip-chip pads. The embedded passive component is electrically connected to the flip chip via the redistribution traces and the flip-chip pads. A plurality of solder balls are placed at the peripheral region of the surface of the dummy chip.
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Information query
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