Invention Grant
- Patent Title: Reliability enhancement process
- Patent Title (中): 可靠性增强过程
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Application No.: US11873146Application Date: 2007-10-16
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Publication No.: US07670877B2Publication Date: 2010-03-02
- Inventor: William E. Murphy , Ryan S. Riegle , Richard W. Shields , David L. Vos
- Applicant: William E. Murphy , Ryan S. Riegle , Richard W. Shields , David L. Vos
- Applicant Address: US MD Bethesda
- Assignee: Lockheed Martin Corporation
- Current Assignee: Lockheed Martin Corporation
- Current Assignee Address: US MD Bethesda
- Agency: Michael Best & Friedrich LLP
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A method of packaging a semiconductor component with a printed wiring board is disclosed. The method includes determining a first distance, applying a thin film onto a surface of the semiconductor component such that the thin film is spaced apart from a support of the semiconductor, applying a solder pad onto the printed wiring board, placing the semiconductor component with the thin film onto the printed wiring board, and positioning the thin film adjacent the solder pad.
Public/Granted literature
- US20080032455A1 RELIABILITY ENHANCEMENT PROCESS Public/Granted day:2008-02-07
Information query
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