A method of fabricating an integrated spatial light modulator. The method includes providing a first substrate including a bonding surface and processing a device substrate to form at least an electrode layer. The method also includes depositing a first portion of a multi-layer standoff layer on the electrode layer, depositing a second portion of the multi-layer standoff layer on the first portion of the multi-layer standoff layer, and forming electrically insulating standoff structures from the multi-layer standoff layer. The method further includes joining the bonding surface of the first substrate to the standoff structures on the device substrate, thinning the first substrate, patterning the first substrate to form a mask, and forming a plurality of moveable structures from the first substrate. The moveable structures are aligned with at least one of the plurality of electrodes and adapted to rotate with respect to the standoff structures.