Invention Grant
- Patent Title: Electronic device fabrication
- Patent Title (中): 电子器件制造
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Application No.: US11099132Application Date: 2005-04-05
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Publication No.: US07670882B2Publication Date: 2010-03-02
- Inventor: Gregory S. Herman , Darin Peterson , Martin Joseph Manning
- Applicant: Gregory S. Herman , Darin Peterson , Martin Joseph Manning
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Main IPC: H01L21/44
- IPC: H01L21/44
Abstract:
A system performs a method including contact printing one of a wetting agent and a non-wetting agent on a semiconductor and inkjet printing an electrically conductive material proximate said one of the wetting agent and the non-wetting agent.
Public/Granted literature
- US20060223241A1 Electronic device fabrication Public/Granted day:2006-10-05
Information query
IPC分类:
