Invention Grant
- Patent Title: Nitrogen based implants for defect reduction in strained silicon
- Patent Title (中): 用于应变硅缺陷还原的氮基植入物
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Application No.: US11268040Application Date: 2005-11-07
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Publication No.: US07670892B2Publication Date: 2010-03-02
- Inventor: Srinivasan Chakravarthi , Pr Chidambaram , Rajesh Khamankar , Haowen Bu , Douglas T. Grider
- Applicant: Srinivasan Chakravarthi , Pr Chidambaram , Rajesh Khamankar , Haowen Bu , Douglas T. Grider
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Agent Jacqueline J. Garner; Wade J. Brady, III; Frederick J. Telecky, Jr.
- Main IPC: H01L21/336
- IPC: H01L21/336 ; H01L21/8234

Abstract:
A transistor is fabricated upon a semiconductor substrate, where the yield strength or elasticity of the substrate is enhanced or otherwise adapted. A strain inducing layer is formed over the transistor to apply a strain thereto to alter transistor operating characteristics, and more particularly to enhance the mobility of carriers within the transistor. Enhancing carrier mobility allows transistor dimensions to be reduced while also allowing the transistor to operate as desired. However, high strain and temperature associated with fabricating the transistor result in deleterious plastic deformation. The yield strength of the silicon substrate is therefore adapted by incorporating nitrogen into the substrate, and more particularly into source/drain extension regions and/or source/drain regions of the transistor. The nitrogen can be readily incorporated during transistor fabrication by adding it as part of source/drain extension region formation and/or source/drain region formation. The enhanced yield strength of the substrate mitigates plastic deformation of the transistor due to the strain inducing layer.
Public/Granted literature
- US20070105294A1 Nitrogen based implants for defect reduction in strained silicon Public/Granted day:2007-05-10
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