Invention Grant
- Patent Title: Method for fabricating a cylindrical capacitor using amorphous carbon-based layer
- Patent Title (中): 使用无定形碳基层制造圆柱形电容器的方法
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Application No.: US11646481Application Date: 2006-12-28
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Publication No.: US07670903B2Publication Date: 2010-03-02
- Inventor: Ki-Seon Park , Jae-Sung Roh , Deok-Sin Kil , Han-Sang Song , Seung-Jin Yeom , Jin-Hyock Kim , Kee-Jeung Lee
- Applicant: Ki-Seon Park , Jae-Sung Roh , Deok-Sin Kil , Han-Sang Song , Seung-Jin Yeom , Jin-Hyock Kim , Kee-Jeung Lee
- Applicant Address: KR Gyeonggi-do
- Assignee: Hynix Semiconductor, Inc.
- Current Assignee: Hynix Semiconductor, Inc.
- Current Assignee Address: KR Gyeonggi-do
- Agency: IP & T Law Firm PLC
- Priority: KR10-2006-0059251 20060629
- Main IPC: H01L21/8242
- IPC: H01L21/8242

Abstract:
A method for fabricating a cylindrical capacitor. The method includes forming an isolation structure including an interlayer on a substrate, the substrate having a plurality of contact plugs formed therein, forming a plurality of opening regions by etching the isolation structure, thereby exposing selected portions of the contact plugs, forming storage nodes on a surface of the opening regions, etching selected portions of the isolation structure to form a patterned interlayer that encompasses selected portions of the storage nodes, thereby supporting the storage nodes, removing remaining portions of the isolation structure, and removing the patterned interlayer to expose inner and outer walls of the storage nodes.
Public/Granted literature
- US20080003741A1 Method for fabricating a cylindrical capacitor using amorphous carbon-based layer Public/Granted day:2008-01-03
Information query
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