Invention Grant
- Patent Title: Configuration of high-voltage semiconductor power device to achieve three dimensional charge coupling
- Patent Title (中): 配置高压半导体功率器件实现三维电荷耦合
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Application No.: US11656104Application Date: 2007-01-22
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Publication No.: US07670908B2Publication Date: 2010-03-02
- Inventor: François Hébert , Tao Feng
- Applicant: François Hébert , Tao Feng
- Applicant Address: BM
- Assignee: Alpha & Omega Semiconductor, Ltd.
- Current Assignee: Alpha & Omega Semiconductor, Ltd.
- Current Assignee Address: BM
- Agent Bo-In Lin
- Main IPC: H01L21/336
- IPC: H01L21/336

Abstract:
This invention discloses semiconductor device that includes a top region and a bottom region with an intermediate region disposed between said top region and said bottom region with a controllable current path traversing through the intermediate region. The semiconductor device further includes a trench with padded with insulation layer on sidewalls extended from the top region through the intermediate region toward the bottom region wherein the trench includes randomly and substantially uniformly distributed nano-nodules as charge-islands in contact with a drain region below the trench for electrically coupling with the intermediate region for continuously and uniformly distributing a voltage drop through the current path.
Public/Granted literature
- US20080173969A1 Configuration of high-voltage semiconductor power device to achieve three dimensionalcharge coupling Public/Granted day:2008-07-24
Information query
IPC分类: