Invention Grant
- Patent Title: Grid array connection device and method
- Patent Title (中): 网格阵列连接装置及方法
-
Application No.: US11167922Application Date: 2005-06-27
-
Publication No.: US07670951B2Publication Date: 2010-03-02
- Inventor: Munehiro Toyama , Siew Fong Tai , Kian Sin Sim , Charan K. Gurumurthy , Selvy Tamil Selvamuniandy
- Applicant: Munehiro Toyama , Siew Fong Tai , Kian Sin Sim , Charan K. Gurumurthy , Selvy Tamil Selvamuniandy
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman, Lundberg & Woessner, P.A.
- Main IPC: H01L21/44
- IPC: H01L21/44
Abstract:
A method and device for input/output connections is provided. Devices and methods for connection structure are shown with improved mechanical properties such as hardness and abrasion resistance. Land grid array structures are provided that are less expensive to manufacture due to reductions in material cost such as gold. Ball grid array structures are provided with improved resistance to corrosion during fabrication. Ball grid array structures are also provided with improved mechanical properties resulting in improved shock testing results.
Public/Granted literature
- US20060292737A1 Grid array connection device and method Public/Granted day:2006-12-28
Information query
IPC分类:
