Invention Grant
- Patent Title: Resin composition
- Patent Title (中): 树脂组成
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Application No.: US11830276Application Date: 2007-07-30
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Publication No.: US07671117B2Publication Date: 2010-03-02
- Inventor: Noritaka Sato , Tsutomu Noguchi , Hiroyuki Mori
- Applicant: Noritaka Sato , Tsutomu Noguchi , Hiroyuki Mori
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sonnenschein Nath & Rosenthal LLP
- Priority: JP2002-263279 20020909; JP2002-263283 20020909
- Main IPC: C07D209/48
- IPC: C07D209/48 ; C08K5/00

Abstract:
Moldings made with a polyester resin which comprises a cyclic compound represented by a following formula A1-B-A2 (in the formula, A1 and A2 are the same or different and show groups represented by a below-described formula, P shows a benzene ring which may be replaced by a material, and B shows a bivalent hydrocarbon group which may be replaced by a material) and polyester capable of having a crystal structure.
Public/Granted literature
- US20090005475A1 RESIN COMPOSITION Public/Granted day:2009-01-01
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