Invention Grant
- Patent Title: Thermoplastic resin having rigidity when heated
- Patent Title (中): 加热时具有刚性的热塑性树脂
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Application No.: US10582556Application Date: 2004-12-09
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Publication No.: US07671142B2Publication Date: 2010-03-02
- Inventor: Tomofumi Maekawa
- Applicant: Tomofumi Maekawa
- Applicant Address: JP Tokyo
- Assignee: Asahi Kasei Chemicals Corporation
- Current Assignee: Asahi Kasei Chemicals Corporation
- Current Assignee Address: JP Tokyo
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2003-412119 20031210
- International Application: PCT/JP2004/018388 WO 20041209
- International Announcement: WO2005/056677 WO 20050623
- Main IPC: C08L69/00
- IPC: C08L69/00 ; C08L67/02

Abstract:
A thermoplastic resin composition which comprises (A) 1 to 99 parts by weight of polytrimethylene terephthalate and (B) 99 to 1 part by weight of a polycarbonate, wherein the ingredient (A) crystallization enthalpy, ΔHcc, which is obtained when the thermoplastic resin composition is heated from 0 ° C. at a rate of 20° C./min is 0 to 15 J/g.
Public/Granted literature
- US20070142571A1 Thermoplastic resin composition Public/Granted day:2007-06-21
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