An inexpensive multilayer wiring circuit board capable of conducting high frequency switching operation on the circuit while the generation of high frequency noise is being suppressed by reducing the inductance of the circuit in provided. A multilayer wiring circuit board with an uppermost layer designated as a first layer on which parts are mounted; a second layer on which one of a ground layer and an electric power source layer is arranged; a third layer on which the other is arranged; and an insulating layer arranged between the ground layer and the electric power source layer. A resin layer having a thermoplastic adhesion property on both faces is used as material of the insulating layer arranged between the electric power source layer and the ground layer.