Invention Grant
- Patent Title: Structure of a circuit board for improving the performance of routing traces
- Patent Title (中): 电路板的结构,用于提高路由轨迹的性能
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Application No.: US10843466Application Date: 2004-05-12
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Publication No.: US07671282B2Publication Date: 2010-03-02
- Inventor: Sheng-Yuan Lee
- Applicant: Sheng-Yuan Lee
- Applicant Address: TW Hsin Tien, Taipei Hsien
- Assignee: Via Technologies, Inc.
- Current Assignee: Via Technologies, Inc.
- Current Assignee Address: TW Hsin Tien, Taipei Hsien
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: TW93103822A 20040217
- Main IPC: H05K1/11
- IPC: H05K1/11

Abstract:
A structure of a circuit board for improving the performance of routing traces is described as eliminating the resonant effects from the inner layers in a circuit board. For eliminating the stray capacitor effect between the planes in the circuit board, the present invention uses a method for etching an area of a power plane and the area is corresponding to a routing plane. Consequently, the routing trace can make good electric potential reference of a ground plane. Due to the reduction of the stray capacitor, the structure for improving the performance of routing traces of the invention can avoid the resonance effect and parasitic resonance in the circuit board as produced in a high-frequency situation in order to promote the quality of the circuit board.
Public/Granted literature
- US20050178583A1 Structure of a circuit board for improving the performance of routing traces Public/Granted day:2005-08-18
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