Invention Grant
- Patent Title: Method and apparatus for laser drilling workpieces
- Patent Title (中): 激光钻孔工件的方法和装置
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Application No.: US10718122Application Date: 2003-11-20
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Publication No.: US07671297B2Publication Date: 2010-03-02
- Inventor: R. Christopher Carney , David Demarest , Reza K. Mozavi , Angel Perez
- Applicant: R. Christopher Carney , David Demarest , Reza K. Mozavi , Angel Perez
- Applicant Address: US NJ Somerville
- Assignee: Ethicon, Inc.
- Current Assignee: Ethicon, Inc.
- Current Assignee Address: US NJ Somerville
- Agency: Nutter McClennen & Fish LLP
- Main IPC: B23K26/00
- IPC: B23K26/00

Abstract:
A method and apparatus for laser drilling a vibrating workpiece. A laser is mounted to a stationary frame. A separate machine having a separate machine frame has a spherical lens mounted to the top of the machine frame in proximity to a workpiece engaged by the machine. The vibrations of the machine caused by operation are transmitted to the lens and workpiece. A laser beam emitted by the laser is transmitted thought the lens and focused on the workpiece. The apparatus and method provides for precisely drilled and located holes or openings in the workpiece.
Public/Granted literature
- US20050109741A1 Method and apparatus for laser drilling workpieces Public/Granted day:2005-05-26
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