Invention Grant
- Patent Title: LED chip package structure with a plurality of thick guiding pins and a method for manufacturing the same
- Patent Title (中): 具有多个厚引导针的LED芯片封装结构及其制造方法
-
Application No.: US11861757Application Date: 2007-09-26
-
Publication No.: US07671374B2Publication Date: 2010-03-02
- Inventor: Bily Wang , Jonnie Chuang , Hui-Yen Huang
- Applicant: Bily Wang , Jonnie Chuang , Hui-Yen Huang
- Applicant Address: TW Hsinchu
- Assignee: Harvatek Corporation
- Current Assignee: Harvatek Corporation
- Current Assignee Address: TW Hsinchu
- Agency: Rosenberg, Klein & Lee
- Priority: TW96103612A 20070131
- Main IPC: H01L29/205
- IPC: H01L29/205 ; H01L23/495
Abstract:
An LED chip package structure with thick guiding pin includes a plurality of conductive pins separated from each other, an insulative casing, a plurality of LED chips, and a packaging colloid. The insulative casing covers a bottom side of each conductive pin to form an injection concave groove for exposing a top surface of each conductive pin. Two lateral sides of each conductive pin are extended outward from the insulative casing. The LED chips are arranged in the injection concave groove, and each LED chip has a positive electrode side and a negative electrode side respectively and electrically connected with different conductive pins. In addition, the packaging colloid is filled into the injection concave groove for covering the LED chips.
Public/Granted literature
Information query
IPC分类:
