Invention Grant
- Patent Title: Nitride-based semiconductor device of reduced voltage drop, and method of fabrication
- Patent Title (中): 降低电压降的氮化物半导体器件及其制造方法
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Application No.: US11378963Application Date: 2006-03-17
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Publication No.: US07671375B2Publication Date: 2010-03-02
- Inventor: Koji Otsuka , Tetsuji Moku , Junji Sato , Yoshiki Tada , Takashi Yoshida
- Applicant: Koji Otsuka , Tetsuji Moku , Junji Sato , Yoshiki Tada , Takashi Yoshida
- Applicant Address: JP
- Assignee: Sanken Electric Co., Ltd.
- Current Assignee: Sanken Electric Co., Ltd.
- Current Assignee Address: JP
- Agency: Woodcock Washburn LLP
- Priority: JP2003-331882 20030924; JP2004-092211 20040326
- Main IPC: H01L33/00
- IPC: H01L33/00

Abstract:
A light-emitting diode is built on a silicon substrate which has been doped with a p-type impurity to possess sufficient conductivity to provide part of the current path through the LED. The p-type silicon substrate has epitaxially grown thereon a buffer region of n-type AlInGaN. Further grown epitaxially on the buffer region is the main semiconductor region of the LED which comprises a lower confining layer of n-type GaN, an active layer for generating light, and an upper confining layer of p-type GaN. In the course of the growth of the buffer region and main semiconductor region there occurs a thermal diffusion of gallium and other Group III elements from the buffer region into the p-type silicon substrate, with the consequent creation of a p-type low-resistance region in the substrate. Interface levels are created across the heterojunction between p-type silicon substrate and n-type buffer region. The interface levels expedite carrier transport from substrate to buffer region, contributing to reduction of the drive voltage requirement of the LED.
Public/Granted literature
- US20060175628A1 Nitride-based semiconductor device of reduced voltage drop, and method of fabrication Public/Granted day:2006-08-10
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