Invention Grant
- Patent Title: Semiconductor device and method of producing the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US11714214Application Date: 2007-03-06
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Publication No.: US07671383B2Publication Date: 2010-03-02
- Inventor: Tetsuya Hayashi , Masakatsu Hoshi , Yoshio Shimoida , Hideaki Tanaka , Shigeharu Yamagami
- Applicant: Tetsuya Hayashi , Masakatsu Hoshi , Yoshio Shimoida , Hideaki Tanaka , Shigeharu Yamagami
- Applicant Address: JP Yokohama-shi
- Assignee: Nissan Motor Co., Ltd.
- Current Assignee: Nissan Motor Co., Ltd.
- Current Assignee Address: JP Yokohama-shi
- Agency: Foley & Lardner LLP
- Priority: JP2006-066492 20060310
- Main IPC: H01L29/732
- IPC: H01L29/732

Abstract:
A semiconductor device, includes: a first conductivity type semiconductor base having a main face; a hetero semiconductor region contacting the main face of the semiconductor base and forming a hetero junction in combination with the semiconductor base, the semiconductor base and the hetero semiconductor region in combination defining a junction end part; a gate insulating film defining a junction face in contact with the semiconductor base and having a thickness; and a gate electrode disposed adjacent to the junction end part via the gate insulating film and defining a shortest point in a position away from the junction end part by a shortest interval, a line extending from the shortest point to a contact point vertically relative to the junction face, forming such a distance between the contact point and the junction end part as to be smaller than the thickness of the gate insulating film contacting the semiconductor base.
Public/Granted literature
- US20070210330A1 Semiconductor device and method of producing the same Public/Granted day:2007-09-13
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