Invention Grant
- Patent Title: Method and device for controlling temperature of a substrate using an internal temperature control device
- Patent Title (中): 使用内部温度控制装置控制基板的温度的方法和装置
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Application No.: US11675210Application Date: 2007-02-15
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Publication No.: US07671412B2Publication Date: 2010-03-02
- Inventor: Michael A. Carcasi , Michael Philip Kincaid
- Applicant: Michael A. Carcasi , Michael Philip Kincaid
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Main IPC: H01L27/01
- IPC: H01L27/01
Abstract:
A substrate, thermal treatment assembly and method of operating the thermal treatment assembly are described for controlling the temperature of a substrate. An electrical potential is applied across two or more locations on the substrate in order to generate an electrical current through a portion of the substrate, thereby altering a temperature of the substrate. The electrical current may dissipate electrical energy in the form of thermal energy due to the intrinsic resistance of the portion of substrate to the flow of electrical current.
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