Invention Grant
- Patent Title: Semiconductor on insulator apparatus
- Patent Title (中): 绝缘体半导体器件
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Application No.: US12195323Application Date: 2008-08-20
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Publication No.: US07671414B2Publication Date: 2010-03-02
- Inventor: Been-Yih Jin , Reza Arghavani , Robert Chau
- Applicant: Been-Yih Jin , Reza Arghavani , Robert Chau
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: H01L23/62
- IPC: H01L23/62

Abstract:
A method and apparatus for producing a relatively thin, relatively uniform semiconductor layer which has improved carrier mobility. In an embodiment, a lattice-matched insulator layer is formed on a semiconductor substrate, and a lattice-matched semiconductor layer is formed on the insulator layer to form a relatively thin, relatively uniform semiconductor on insulator apparatus. In embodiments of the method and apparatus, energy band characteristics may be used to facilitate the extraction of the well-region minority carriers.
Public/Granted literature
- US20080303116A1 SEMICONDUCTOR ON INSULATOR APPARATUS Public/Granted day:2008-12-11
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