Invention Grant
- Patent Title: Tape carrier, semiconductor apparatus, and semiconductor module apparatus
- Patent Title (中): 带载体，半导体装置和半导体模块装置
-
Application No.: US11798232Application Date: 2007-05-11
-
Publication No.: US07671454B2Publication Date: 2010-03-02
- Inventor: Toshiharu Seko
- Applicant: Toshiharu Seko
- Applicant Address: JP Osaka
- Assignee: Sharp Kabushiki Kaisha
- Current Assignee: Sharp Kabushiki Kaisha
- Current Assignee Address: JP Osaka
- Agency: Harness, Dickey & Pierce
- Priority: JP2006-134426 20060512
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L21/50
Abstract:
A tape carrier of the present invention includes an insulating tape and a wiring pattern formed on the insulating tape. The wiring pattern includes a connecting section via which the wiring pattern is connected to a bump electrode. The connecting section is provided at a part of an overlap part of the wiring pattern, which overlap part overlaps a semiconductor device when the semiconductor device is mounted on the wiring pattern. The connecting section of the wiring pattern is smaller in wiring width than the remaining part of the overlap part, which remaining part is other than the connecting section.
Public/Granted literature
- US20070262425A1 Tape carrier, semiconductor apparatus, and semiconductor module apparatus Public/Granted day:2007-11-15
Information query
IPC分类:
