Invention Grant
- Patent Title: Enhanced mechanical strength via contacts
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Application No.: US12179057Application Date: 2008-07-24
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Publication No.: US07671470B2Publication Date: 2010-03-02
- Inventor: Chih-Chao Yang , Griselda Bonilla , Shyng-Tsong Chen , Kelly Malone
- Applicant: Chih-Chao Yang , Griselda Bonilla , Shyng-Tsong Chen , Kelly Malone
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Joseph Petrokaitis
- Main IPC: H01L21/461
- IPC: H01L21/461
Abstract:
The present invention provides an enhanced interconnect structure with improved reliability. The inventive interconnect structure has enhanced mechanical strength of via contacts provided by embedded metal liners. The embedded metal liners may be continuous or discontinuous. Discontinuous embedded metal liners are provided by a discontinuous interface at the bottom of the via located within the interlayer dielectric layer.
Public/Granted literature
- US20080284030A1 ENHANCED MECHANICAL STRENGTH VIA CONTACTS Public/Granted day:2008-11-20
Information query
IPC分类:
