A semiconductor device package (10) with a substantially rectangular shape comprising: a die attach pad (12) having a top surface and a bottom surface; a plurality of contact pads (26i-26n) provided in at least four rows that correspond to the rectangular shape of the package, each contact pad having a top surface and a bottom surface; at least two tie bars (18) for supporting the die attach pad until the singulation of the package during manufacturing thereof the tie bars having a top surface and a bottom surface and extending from the die attach pad towards a corner of the package; —a semiconductor die (20) mounted on the top surface of the die attach pad (12) and having bonding pads (44) formed thereon; a plurality of electrical connections between selected ones of the bond pads (44) and corresponding ones of the contact pads (26i-26n); an encapsulation encapsulating the semiconductor die (20), the top surface of the die attach pad (12), the electrical connections, the top surface of the tie bars (18) and the top surfaces of the contact pads (26^2On), and leaving the bottom surface of the die attach pad and the bottom surface of the contact pads exposed; characterized in that, at least one strip (30) having a top surface and a bottom surface is disposed between the die attach pad (12) and a corresponding row of contact pads, the strip having at least one lateral part (36) that is connected to at least one of the contact pads in said row, electrical connections being provided between the strip and selected bond pads (44) on the semiconductor die (20) adjacent to the strip.