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US07671477B2 Technique for moderating stresses cause by a difference in thermal expansion coeffiecients between a substrate and an electronic component 有权
用于调节应力的技术由基板和电子部件之间的热膨胀系数的差异引起

  • Patent Title: Technique for moderating stresses cause by a difference in thermal expansion coeffiecients between a substrate and an electronic component
  • Patent Title (中): 用于调节应力的技术由基板和电子部件之间的热膨胀系数的差异引起
  • Application No.: US11566885
    Application Date: 2006-12-05
  • Publication No.: US07671477B2
    Publication Date: 2010-03-02
  • Inventor: Hironobu Ikeda
  • Applicant: Hironobu Ikeda
  • Applicant Address: JP Tokyo
  • Assignee: NEC Corporation
  • Current Assignee: NEC Corporation
  • Current Assignee Address: JP Tokyo
  • Agency: Dickstein Shapiro LLP
  • Priority: JP2005-351285 20050512
  • Main IPC: H01L23/48
  • IPC: H01L23/48 ;  H01L23/52
Technique for moderating stresses cause by a difference in thermal expansion coeffiecients between a substrate and an electronic component
Abstract:
A device comprises a plurality of first electrodes which are arranged on a surface of a substrate at predetermined space, a component which has an elasticity and a longitudinal axis, a plurality of conductors which are applied to a surface of said component at predetermined space, and each of which are connected to a corresponding one of said first electrodes, and a plurality of second electrodes which are arranged on a surface of a electronic component at predetermined space, and each of which are connected to a corresponding one of said conductors.
Abstract(Chinese):

一种器件包括：多个第一电极，其布置在基板的预定空间的表面上，具有弹性和纵向轴线的部件;多个导体，其以预定空间施加到所述部件的表面;以及 每个连接到所述第一电极中的相应一个，以及以预定空间布置在电子部件的表面上的多个第二电极，并且每个连接到相应的一个所述导体。

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