Invention Grant
- Patent Title: Semiconductor probe having embossed resistive tip and method of fabricating the same
- Patent Title (中): 具有压电电阻端头的半导体探针及其制造方法
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Application No.: US11772441Application Date: 2007-07-02
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Publication No.: US07671616B2Publication Date: 2010-03-02
- Inventor: Ju-hwan Jung , Jae-hong Lee , Hyung-cheol Shin , Jun-soo Kim , Seung-bum Hong
- Applicant: Ju-hwan Jung , Jae-hong Lee , Hyung-cheol Shin , Jun-soo Kim , Seung-bum Hong
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2006-0102467 20061020
- Main IPC: G01R31/02
- IPC: G01R31/02 ; G01N23/00

Abstract:
A semiconductor probe having an embossed resistive tip and a method of fabricating the semiconductor probe are provided. The semiconductor probe includes a protrusion portion protruded to a predetermined height on a cantilever in a first direction crossing a length direction of the cantilever, an embossed resistive tip formed on the protrusion portion, and first and second semiconductor electrode regions formed at opposite sides of the embossed resistive tip at the protrusion portion, wherein the cantilever is doped with a first dopant, the first and second semiconductor electrode regions and the embossed resistive tip are doped with a second dopant having a different polarity from the first dopant, and the embossed resistive tip is doped with a concentration lower than the first and second semiconductor electrode regions.
Public/Granted literature
- US20080094089A1 SEMICONDUCTOR PROBE HAVING EMBOSSED RESISTIVE TIP AND METHOD OF FABRICATING THE SAME Public/Granted day:2008-04-24
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