Invention Grant
US07671617B2 Test system to test multi-chip package compensating a signal distortion
有权
测试系统测试多芯片封装补偿信号失真
- Patent Title: Test system to test multi-chip package compensating a signal distortion
- Patent Title (中): 测试系统测试多芯片封装补偿信号失真
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Application No.: US11983110Application Date: 2007-11-07
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Publication No.: US07671617B2Publication Date: 2010-03-02
- Inventor: Ki-Jae Song
- Applicant: Ki-Jae Song
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Mills & Onello LLP
- Priority: KR10-2006-0109436 20061107
- Main IPC: G01R31/26
- IPC: G01R31/26
Abstract:
A test system includes: a tester; and a test board, on which a multi-chip package including plural memories is mounted, being connected to the tester by way of a transmission line. The transmission line includes a compensation unit for compensating signal distortion.
Public/Granted literature
- US20080106296A1 Test system of multi-chip package with improved signal integrity by restraining reflection wave Public/Granted day:2008-05-08
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