Invention Grant
- Patent Title: Surface configuration measuring method and surface configuration measuring system
- Patent Title (中): 表面配置测量方法和表面配置测量系统
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Application No.: US11096648Application Date: 2005-04-01
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Publication No.: US07671998B2Publication Date: 2010-03-02
- Inventor: Fumio Ohtomo , Hitoshi Otani
- Applicant: Fumio Ohtomo , Hitoshi Otani
- Applicant Address: JP Tokyo-to
- Assignee: Kabushiki Kaisha TOPCON
- Current Assignee: Kabushiki Kaisha TOPCON
- Current Assignee Address: JP Tokyo-to
- Agency: Nields, Lemack & Frame, LLC
- Priority: JP2004-135439 20040430
- Main IPC: G01C11/06
- IPC: G01C11/06
Abstract:
A measuring method, comprising a step of drawing a line on a surface such as ground surface, a step of performing measurement along the line on a predetermined measurement range including the line, a step of acquiring an image of a range including the predetermined measurement range as an image data, a step of superimposing the image data on a measurement data, and a step of calculating a measurement data of the line from line position in the image data and from the measurement data near the line.
Public/Granted literature
- US20050243329A1 Measuring method and measuring system Public/Granted day:2005-11-03
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