Invention Grant
- Patent Title: Apparatus, data processing apparatus and heat radiating member
- Patent Title (中): 装置,数据处理装置和散热构件
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Application No.: US11656552Application Date: 2007-01-23
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Publication No.: US07672123B2Publication Date: 2010-03-02
- Inventor: Ikki Tatsukami
- Applicant: Ikki Tatsukami
- Applicant Address: JP Kawasaki
- Assignee: Fujitsu Limited
- Current Assignee: Fujitsu Limited
- Current Assignee Address: JP Kawasaki
- Agency: Staas & Halsey LLP
- Priority: JP2006-222130 20060816
- Main IPC: H05K5/00
- IPC: H05K5/00 ; H05K7/20

Abstract:
An apparatus includes: a first heat generating component; a second heat generating component arranged close to the side of the first heat generating component; a heat radiating member that absorbs heat from both the first heat generating component and the second heat generating component and radiates heat. The heat radiating member includes: a base section that extends horizontally and contacts the first heat generating component on the bottom surface of the base section; and a pair of arms that extend horizontally at both ends of the base section, have a fastener for fastening the heat radiating member, and contact the second heat generating component under one of the pair of arms.
Public/Granted literature
- US20080043429A1 Apparatus, data processing apparatus and heat radiating member Public/Granted day:2008-02-21
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