Invention Grant
- Patent Title: Electronic packaging apparatus and method
- Patent Title (中): 电子包装设备及方法
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Application No.: US11566992Application Date: 2006-12-05
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Publication No.: US07672132B2Publication Date: 2010-03-02
- Inventor: Thomas J Fitzgerald , Carl L. Deppisch , Manjit Dhindsa , Mark Norwil , Matthew J. Schaenzer
- Applicant: Thomas J Fitzgerald , Carl L. Deppisch , Manjit Dhindsa , Mark Norwil , Matthew J. Schaenzer
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman, Lundberg & Woessner, P.A.
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H01L23/34
Abstract:
An electronic assembly includes a substrate, a device attached to the substrate, and a thermally conductive heat spreader covering the device and at least a portion of the substrate. A metal substantially fills the space between the device and the thermally conductive heat spreader. A method includes attaching at least one die to a substrate, placing a thermally conductive heat spreader over the die, and injecting a molten metal material into the space between the thermally conductive heat spreader and the die.
Public/Granted literature
- US20070097650A1 ELECTRONIC PACKAGING APPARATUS AND METHOD Public/Granted day:2007-05-03
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