Invention Grant
- Patent Title: Grounded flexible circuits
- Patent Title (中): 接地柔性电路
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Application No.: US11650116Application Date: 2007-01-05
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Publication No.: US07672142B2Publication Date: 2010-03-02
- Inventor: Erik L. Wang , Philip Michael Hobson , Kenneth A. Jenks , Robert J. Hill , Robert W. Schlub
- Applicant: Erik L. Wang , Philip Michael Hobson , Kenneth A. Jenks , Robert J. Hill , Robert W. Schlub
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agent David C. Kellogg
- Main IPC: H01R12/16
- IPC: H01R12/16

Abstract:
Electronic devices may be provided with one or more electrical components that may be coupled to one or more circuit boards by flexible circuits that can have reduced ground lengths. Each flexible circuit can include at least one ground conductor that may run along its length and that may have at least one portion exposed for coupling to a grounding element that may also be coupled to a ground plane.
Public/Granted literature
- US20080164055A1 Grounded flexible circuits Public/Granted day:2008-07-10
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