Invention Grant
- Patent Title: Surface-emitting semiconductor array device, module, light source device, data processing apparatus, light transmitting device, light spatial transmitting apparatus, and light spatial transmitting system
- Patent Title (中): 表面发射半导体阵列器件，模块，光源器件，数据处理设备，光发射器件，光空间传输器件和光空间传输系统
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Application No.: US11728482Application Date: 2007-03-26
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Publication No.: US07672352B2Publication Date: 2010-03-02
- Inventor: Nobuaki Ueki , Yasuaki Miyamoto , Jun Sakurai , Terutaka Inoue
- Applicant: Nobuaki Ueki , Yasuaki Miyamoto , Jun Sakurai , Terutaka Inoue
- Applicant Address: JP Tokyo
- Assignee: Fuji Xerox Co., Ltd.
- Current Assignee: Fuji Xerox Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Fildes & Outland, P.C.
- Priority: JP2006-264958 20060928
- Main IPC: H01S5/42
- IPC: H01S5/42
Abstract:
A surface-emitting semiconductor array device includes a substrate, a plurality of light-emitting portions, an electrode pad portion formed on the substrate and disposed through the plurality of light-emitting portions and a dividing groove, and having a plurality of electrode pads formed on an insulating film, and a plurality of metal wirings for connecting each of the plurality of light-emitting portions to a corresponding electrode pad through the dividing groove, the dividing groove has a wave-shaped side wall formed on the substrate.
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