Invention Grant
- Patent Title: Hot plug interface control method and apparatus
- Patent Title (中): 热插拔接口控制方法和装置
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Application No.: US10028858Application Date: 2001-12-19
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Publication No.: US07673090B2Publication Date: 2010-03-02
- Inventor: Shivnandan D. Kaushik , Ling Cen , James B. Crossland , Mohan J. Kumar , Linda J. Rankin , David J. O'Shea
- Applicant: Shivnandan D. Kaushik , Ling Cen , James B. Crossland , Mohan J. Kumar , Linda J. Rankin , David J. O'Shea
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agent Derek J. Reynolds
- Main IPC: H05K7/10
- IPC: H05K7/10 ; G06F13/24 ; G06F13/32 ; G06F12/00 ; G06F13/00 ; G06F13/28
Abstract:
Hot plug modules comprising processors, memory, and/or I/O hubs may be added to and removed from a running computing device without rebooting the running computing device. The hot plug modules and computing device comprise hot plug interfaces that support hot plug addition and hot plug removal of the hot plug modules.
Public/Granted literature
- US20030167367A1 Hot plug interface control method and apparatus Public/Granted day:2003-09-04
Information query
