Invention Grant
- Patent Title: Instruction set with thermal opcode for high-performance microprocessor, microprocessor, and method therefor
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Application No.: US11933910Application Date: 2007-11-01
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Publication No.: US07673158B2Publication Date: 2010-03-02
- Inventor: Hien P. Dang , Arun Sharma , Sri M. Sri-Jayantha
- Applicant: Hien P. Dang , Arun Sharma , Sri M. Sri-Jayantha
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: McGinn IP Law Group PLLC
- Agent Vazken Alexanian
- Main IPC: G06F1/00
- IPC: G06F1/00
Abstract:
A method (and system) of managing heat in an electrical circuit, includes using a thermal instruction appended to an instruction to be processed to determine a heat load associated with the instruction.
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