A method for manufacturing a circuit-board layer on a base surface (2), which base surface (2) includes conductor patterns (19). The circuit-board layer being manufactured comprises a conductor-pattern layer (14), an insulating layer (1), and at least one component (6) inside the insulating-material layer (1). According to the invention, the component (6) is attached to the conductor layer (4), the conductor layer (4) is aligned relative to the base surface (2) attached with the aid of an insulating material (1) to the base surface (2). An insulating-material layer (1) is thus formed between the conductor layer (4) and the base surface (2), on which the said at least one component (6) is located. Electrical contacts are formed between the contact areas (7) of the component (6) and the conductor layer (4), in such a way that contact openings (17) are opened at the positions of the contact areas (7) of the component (6) and conductive material is made in the contact openings (17). The conductor layer (4) is patterned to form a conductor-pattern layer (14), and at least one via (20) is made between the conductor-pattern layer (14) and the conductor patterns (19) of the base surface (2).