Invention Grant
- Patent Title: Inspection device for humidity sensor and method for adjusting sensor characteristics of humidity sensor
- Patent Title (中): 湿度传感器检测装置及湿度传感器传感器特性调整方法
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Application No.: US11727994Application Date: 2007-03-29
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Publication No.: US07673493B2Publication Date: 2010-03-09
- Inventor: Toshikazu Itakura , Toshiki Isogai
- Applicant: Toshikazu Itakura , Toshiki Isogai
- Applicant Address: JP Kariya JP Nishio
- Assignee: DENSO CORPORATION,Nippon Soken, Inc.
- Current Assignee: DENSO CORPORATION,Nippon Soken, Inc.
- Current Assignee Address: JP Kariya JP Nishio
- Agency: Posz Law Group, PLC
- Priority: JP2005-64405 20050308
- Main IPC: G01N21/00
- IPC: G01N21/00

Abstract:
An inspection device inspects a humidity sensor having a sensor portion and a circuit portion, which are integrated into one chip. The inspection device includes: an inspection chamber for accommodating a wafer, in which a plurality of humidity sensors are disposed as a sensor chip in a wafer state; a probe for contacting an electrode pad of the circuit portion; a tester electrically connected to the probe for inspecting electric properties of the humidity sensor; and a temperature-humidity control portion for controlling a temperature and a humidity in the inspection chamber.
Public/Granted literature
- US20070169535A1 Inspection device for humidity sensor and method for adjusting sensor characteristics of humidity sensor Public/Granted day:2007-07-26
Information query