Invention Grant
- Patent Title: Flexible modular sensor systems
- Patent Title (中): 灵活的模块化传感器系统
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Application No.: US11382695Application Date: 2006-05-10
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Publication No.: US07673528B2Publication Date: 2010-03-09
- Inventor: Euisik Yoon , Hyung-Kew Lee
- Applicant: Euisik Yoon , Hyung-Kew Lee
- Agency: Craig Taylor Law Office, PLLC
- Priority: KR10-2005-0039803 20050512; KR10-2005-0044570 20050526
- Main IPC: G01D7/00
- IPC: G01D7/00

Abstract:
Sensor systems, methods of making sensor modules and circuit modules, and methods of making expanded sensor systems including the sensor modules and circuit modules. A sensor module can include a flexible substrate, internal conductor lines, edge conductor lines for module interconnection, and sensors integrated thereon. One sensor module includes an array of interconnected capacitive pressure tactile sensors (taxels), being row addressable from address lines and readable through data lines. The sensor modules can be bonded to each other to form a larger array of sensors. One bonding method utilizes anisotropic conductive paste (ACP). The sensor system provided can be flexible and easy to expand to cover large areas. By using various sensor modules, the sensor system can be used for various applications. Readout modules can be coupled to the exterior edges to read all the individual sensors. Applications include robotic skin and wearable sensor fabrics.
Public/Granted literature
- US20060254369A1 FLEXIBLE MODULAR SENSOR SYSTEMS Public/Granted day:2006-11-16
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