The invention provides a method for treating a subterranean formation penetrated by a wellbore. The method comprises the steps of: (a) introducing a composition through the wellbore into the subterranean formation, wherein the composition comprises: (i) a solvent consisting essentially of an aqueous dissolvable solvent comprising any solvent that is at least 25% by weight soluble in water, wherein the solvent is from about 90% to about 99.9% by weight of the composition; and (ii) a curable resin, wherein the curable resin is from about 0.01% to about 10% by weight of the composition; wherein the curable resin and the solvent are mutually selected such that, for the ratio of the curable resin to the solvent, the curable resin is soluble in the solvent; and (b) installing a mechanical sand control device into the wellbore either before or after introducing the composition into the wellbore.