The package opening device is an adhesive strip adapted for mounting on a cover of a package, the adhesive strip having a gripping member allowing the user to pull on the gripping member to tear at least a portion of the cover of the package. The package opening device includes a base strip having a proximal portion, a distal portion, an upper surface, and a lower surface. An adhesive layer at least partially covers the distal portion of the lower surface of the base strip, and the uncovered proximal portion forms the gripping member. Further, a release liner may be provided for covering the adhesive layer prior to application to the cover of the package. Alternatively, a plurality of adhesive strips may be provided, with the plurality of adhesive strips being joined together by a line, with user-generated tension in the line creating the tearing force.