Invention Grant
- Patent Title: Leveling assembly
- Patent Title (中): 调平总成
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Application No.: US11701827Application Date: 2007-02-02
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Publication No.: US07673845B2Publication Date: 2010-03-09
- Inventor: Robert Dam , Chong B. Wong
- Applicant: Robert Dam , Chong B. Wong
- Applicant Address: US IL Glenview
- Assignee: Illinois Tool Works Inc.
- Current Assignee: Illinois Tool Works Inc.
- Current Assignee Address: US IL Glenview
- Agent Mark W. Croll; Paul F. Donovan
- Main IPC: A47B91/02
- IPC: A47B91/02 ; D06F39/12

Abstract:
Embodiments of the present invention provide a leveling assembly configured to be secured to an appliance. The leveling assembly supports the appliance on a floor, and includes a base having a column integrally connected to a ledge, which is integrally connected to a stem. The assembly also includes a spring positioned around the stem, and a sleeve secured to the stem and positioned around the spring. The spring exerts equal and opposite forces into the sleeve and the ledge, respectively.
Public/Granted literature
- US20070267561A1 Leveling assembly Public/Granted day:2007-11-22
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