A flexible circuit having improved corrosion resistance and method therefor. The flexible circuit includes, a polymeric support substrate, a conductive layer providing tracing attached to a first surface of the support substrate, and lead beams in electrical communication with the tracing for attaching the flexible circuit to a micro-fluid ejection head. A plasma polymerized layer is deposited on at least a portion of the conductive layer to reduce corrosion of the conductive layer. The plasma polymerized layer may also improve adhesion between the flexible circuit and an adhesive use to attach the flexible circuit to a structure.