Invention Grant
- Patent Title: High density mount for a co-axial connector
- Patent Title (中): 用于同轴连接器的高密度安装
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Application No.: US12156945Application Date: 2008-06-04
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Publication No.: US07674131B2Publication Date: 2010-03-09
- Inventor: Cyle D. Petersen , Scott K. Baker
- Applicant: Cyle D. Petersen , Scott K. Baker
- Applicant Address: US MN Eden Prairie
- Assignee: ADC Telecommunications, Inc.
- Current Assignee: ADC Telecommunications, Inc.
- Current Assignee Address: US MN Eden Prairie
- Agency: Merchant & Gould P.C.
- Main IPC: H01R9/05
- IPC: H01R9/05
Abstract:
The present disclosure relates to a connector having a main body portion and a housing portion. The housing mounts over the connector main body. The housing is adapted for securing the connector to another element such as a piece of telecommunications equipment.
Public/Granted literature
- US20090017705A1 High density mount for a co-axial connector Public/Granted day:2009-01-15
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